1. Electronics Desktop now uses the industry standard Parasolid geometry kernel.
  3. General Electronics Desktop
  4. - Ability to export images in non-graphical mode
  5. - Multi-level distribution in large-scale distributed solves
  6. - Batch option to select Intel MPI version
  7. - Property scripting API enhancements
  8. - Improved performance for refinement of large meshes
  9. HFSS
  10. - Support for modal ports and components in terminal designs
  11. - Improved workflows for layout components
  12. - Improved HPC performance for distributed mesh fusion solver
  13. - Iterative solver option for mesh fusion
  14. - Improved performance of domain solver for large arrays
  15. - Option to set phase center at port location
  16. - AMD math libraries with direct matrix solver
  17. - Improved TDR calculation
  18. - Parallel component adaptive for 3D Component arrays (Beta)
  19. - Nonlinear Drude model for plasma density in implicit transient (Beta)
  20. - SBR+ enhancements:
  21. . Custom arrays
  22. . Support for PTD/UTD in advanced doppler processing
  23. . File-based near field
  24. . Near field performance improvements
  25. [b]HFSS 3D Layout[/b]
  26. - Etching workflow and robustness improvements
  27. - Arbitrary backdrill depth
  28. - Layout and ECAD usability and performance enhancements
  29. - AMD math libraries with direct matrix solver
  30. - Iterative solver option for mesh fusion
  31. - Improved TDR calculation
  32. - Solution management improvements
  33. - IC Layout mode (Beta)
  34. - Rigid flex multi-zone workflow (Beta)
  35. - Support for wave ports in broadband frequency sweep (Beta)
  36. [b]SIwave[/b]
  37. - HFSS region clipping and configuration enhancements
  38. - Robustness improvements for CPA and PSI simulation modes
  39. - Option to explicitly specify trace cross-section orientation
  40. - Workflow and accuracy improvements for s-parameter components
  41. - Signal Net Analyzer report export enhancements
  42. - DCIR field post-processing enhancements
  43. - Validation check performance improvements
  44. - CPA package netlist remapping to fit any chip
  45. - CPA package netlist simplification and resynthesis
  46. - Ability to specify multiple ground nets for VRMs during CPA simulations
  47. [b]Icepak[/b]
  48. - Slider bar and HDM meshing enhancements
  49. - Graphical monitoring of batch solves
  50. - Export of heat transfer coefficients in CTM v2
  51. - Export of temperature data from multiple PCBs to Sherlock
  52. - ECXML export
  53. - Support for altitude effects
  54. - Selection of 2D profile interpolation method
  55. - New toolkits for snapping and heat sinks
  56. - New Getting Started Guides: Finned Heat Sink, RF Amplifier, Optimization of Fan Location, and Cold Plate Model
  57. - ROM Delphi support for BGAs (Beta)
  58. - Support for direct post-processing of hybrid meshes (Beta)
  59. [b]Maxwell[/b]
  60. - Windings in magnetostatic
  61. - Force density calculation improvements
  62. - Enhanced workflows for co-simulation with Motion
  63. - Support for parallel branches in windings with solid conductors
  64. - Half-axial symmetry for object-based harmonic force in transient
  65. - Improved hp-assignment efficiency for complex geometries in eddy and magnetostatic
  66. - ROM-based efficiency map for induction machines in the electric machine toolkit
  67. - Electric machine toolkit workflow improvements
  68. - Thin layer boundary for 3D DC conduction
  69. - TDM support for different time steps between source and target
  70. - Option to use Lorentz force calculation in 3D transient
  71. - New design setting to skip mesh quality checks
  72. - Band mapping angle meshing for 2D transient (Beta)
  73. [b]Mechanical[/b]
  74. - Thermal contacts
  75. - Reference temperature for objects in Structural
  76. [b]Q3D Extractor[/b]
  77. - Performance improvements for E and H fields
  78. - Infinite ground plane for CG
  79. - Stability enforcement and passivity check for RLGC SPICE export
  80. - Transition region solver for AC-RL (Beta)
  81. - Distributed memory solver for CG (Beta)
  83. [b][i]Circuit[/i][/b]
  85. [b]General Enhancements:[/b]
  86. - Adaptive time-stepping for nonlinear simulations
  87. - Tx/Rx support for IBIS-AMI models
  88. - Virtual EMI test receiver component (Beta)
  89. - Augmented-Data Passivity Enforcement for state-space fitting (Beta)
  90. - Automatic tuning of HFSS 3D Layout ports in NuHertz (Beta)
  91. [b]SPISim:[/b]
  92. - Ability to directly enable ERL calculation
  93. - Workflow improvements for SERDES channel compliance
  94. - Ability to specify Tx IBIS models and use slew rate in COM
  95. [b]EMIT[/b]
  96. - Results and post-processing API
  97. - Workflow usability enhancements
  99. [b][i]Twin Builder[/i][/b]
  101. [b]Reduced Order Model:[/b]
  102. - Linear Static ROM with support for large number of parameters
  103. - Linear Dynamic ROM
  104. - Image generation with geometry deformation for ROMs
  105. [b]Modelica Editor:[/b]
  106. - Enhanced bijection (text-to-diagram) support
  107. - Enhanced diagram graphics
  108. [b]General Enhancements:[/b]
  109. - Support for Hierarchical parameters in the Model Parameter dialog box
  110. - Model Exchange (ME) FMU support in Twin Deployer
  111. - Support for gradient fitting in device characterization
  112. - Carrier wave options in the SVPWM component
  113. - Automatic pin connection for large components
  115. [b][i]Granta[/i][/b]
  117. [b]Granta Materials Library:[/b]
  118. - Ethylene glycol and propylene glycol records are updated with thermal expansion, density vs. temperature, viscosity vs. temperature and molecular data changes
  119. - Missing molecular mass values are populated for all fluids
  120. - Temperature dependent Young's modulus removed for Plastic, PA12 (rigid)
  121. - Hc value removed for soft magnets
  122. - There are no additional materials/records in the Materials Library in this release, but some property values are updated as a result of bug fixing
  123. [b]Granta Producer Materials Library:[/b]
  124. - Added 8 new PCB laminates from two new producers: Arlon and Taconic
  125. - Added 9 new PCB laminates for the existing producers: Rogers, EMC, Shengyi and Ventec
  126. - Added 1 new polymer-elastomer material for the existing producer: Laird
  127. - Gap filled some mechanical and thermal properties.
  129. [b]Electronics Desktop[/b]
  130. - 668753 - 2D rectangular Description scale now aligns with actual data.
  131. - 697479 - Resolved negative time in some Descriptions.
  132. [b]EMIT[/b]
  133. - 653522 - Resolved EMIT Classic library import problem from 2022 R2.
  134. - 668707 - Intermod equation is now correct for N-1 with multiple amplifiers.
  135. [b]HFSS[/b]
  136. - 654756 - Slanted Co and Cross polarization now has corrected formulation.
  137. - 685177 - Font options now correctly appear for Smith Chart.
  138. - 692410 - VRT is now correct with multiple objects and penetrable materials.
  139. [b]HFSS 3D Layout[/b]
  140. - 618343 - Fields now correctly Description on mesh fusion component.
  141. [b]Icepak[/b]
  142. - 647899 - Conducting Plate Thermal Model with Shell Conduction and anisotropic thermal conductivity of Shell Conduction Zones works as intended.
  143. - 655588 - Via Property Import for Classic Icepak model is now working correctly.
  144. - 673227 - EM Loss visualization on PCBs is now working.
  145. - 688342 - Face monitors can be correctly defined on fan components.
  146. [b]Maxwell[/b]
  147. - 690031 - Transient/Harmonic Force Data Extraction calculates correctly when using If command in Time Step.
  148. - 691114 - TransientForce_t() now returns correct data.
  149. [b]Mechanical[/b]
  150. - 685199 - Specific designs that failed when "Mechanical Contacts" beta option was enabled now work correctly.
  151. [b]Q3D Extractor[/b]
  152. - 685300 - Sink terminal name is now correct after Series matrix reduction.
  153. [b]SIwave[/b]
  154. - 510943 - Improvements to PCB hole modeling during SIwave-Icepak thermal simulations.
  155. - 658563 - SIwave validation check performance and robustness improvements.
  156. - 701679 - Improvements to DS material model export fidelity from SIwave to HFSS and Q3D.
  157. [b]Twin Builder[/b]
  158. - 663201 - Modelica IDE: Icon graphics from libraries are properly displayed now.
  159. - 708978 - Duplicate library entries in Modelica path are now only loaded once